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1/4
Structure Product Name
Silicon Monolithic Integrated Circuit Compound LED Driver for cellular phone
Type
BD60910GU
Boost DC/DC for LED back lighting Constant current driver for LED back lighting Auto Luminous Control (ALC)
Features
Absolute Maximum RatingsTa=25 Parameter Maximum voltage 1 Maximum voltage 2 Maximum voltage 3 Power Dissipation Operating Temperature Range Storage Temperature Range Symbol VMAX1 VMAX2 VMAX3 Pd Topr Tstg Limits 7 15 32.6 1250 -40 ~ +85 -55 ~ +150 Unit V V V mW
o o
Pins except for VLED, VOUT, SW VLED VOUT, SW
C C
o o notePower dissipation deleting is 10mW/ C, when it's used in over 25 C.
(It's deleting is on the board that is ROHM's standard) Dissipation by LSI should not exceed tolerance level.of Pd. Operating conditionsVBATVIO, Ta=-4085 Parameter VBAT input voltage VIO pin voltage * Radiation-proof is not designed. Symbol VBAT VIO Limits 2.75.5 1.653.3 Unit V V
REV. A
2/4 Electrical Characteristics (Unless otherwise specified, Ta=25C, VBAT=3.6V, VIO=1.8V)
Parameter Circuit Current VBAT Circuit current 1 VBAT Circuit current 2 VBAT Circuit current 3 Symbol IBAT1 IBAT2 IBAT3 Min. Typ. 0.1 0.5 2.5 Max. 1.0 3.0 5.0 Unit A A mA Condition RESETB=0V, VIO=0V RESETB=0V, VIO=1.8V LED=ON, ILED=15mA setting Vo=24V Only ALC block ON ADCYC=0.52s setting Except sensor current
VBAT Circuit current 4 LED Driver LED current Step (Setup) LED current Step (At slope) LED Maximum current LED current accuracy DC/DC VLED pin feedback voltage Over current protection Oscillator frequency Over Voltage Protection detect voltage
IBAT4
-
0.4
1.0
mA
ILEDSTP1 ILEDSTP2 IMAXWLED IWLED Vfb OCP fosc OVP1 OVP2 OVP3 OVP4 OVP5 Mduty OVO -7% 0.8 30 92.5 -
128 256 25.6 15 0.3 650 1.0 31 27 24 21 18 0.7 +7% 1.2 32 1.4 0.25 x VIO VBAT +0.3 0.3 3 0.25 x VIO VBAT +0.3 3 3.150 2.730 30 VoS x 255/256 1.5 +3 +1 -
Step Step mA mA V mA MHz V V V V V % V ILED=15mA setting
Maximum Duty VOUT open protection I C input (SDA, SCL) LOW level input voltage HIGH level input voltage Hysteresis of Schmitt trigger input LOW level output voltage (SDA) at 3mA sink current Input current RESETB LOW level input voltage HIGH level input voltage Input current ALC SBIAS Output voltage SBIAS Output current SSENS Input range SBIAS Discharge resister at OFF ADC resolution ADC non-linearity error ADC differential non-linearity error SSENS Input impedance
2
VIL VIH Vhys VOL lin
-0.3 0.75 x VIO 0.05 x VIO 0 -3
-
V V V V A Input voltage = 0.1xVIO~0.9xVIO
VIL VIH Iin
-0.3 0.75 x VIO -3 2.850 2.470 0 -3 -1 1
3.0 2.6 1.0 8 -
V V A V V mA V k bit LSB LSB M Input voltage = 0.1xVIO~0.9xVIO Io=200A < Initial value > Io=200A Vo=3.0V
VoS IoS VISS ROFFS ADRES ADINL ADDNL RSSENS
REV. A
3/4 Electrical Characteristics (Unless otherwise specified, Ta=25C, VBAT=3.6V, VIO=1.8V)
WPWMIN L level input voltage H level input voltage Input current PWM input minimum High pulse width GC1, GC2 L level output voltage H level output voltage VILA VIHA IinA PWpwm -0.3 1.4 50 3.6 0.3 VBAT +0.3 10 V V A s Vin=1.8V
VOLS VOHS
VoS -0.2
-
0.2 -
V V
IOL=1mA IOH=1mA
Outside size figure
D60910
LOT No.
VCSP85H324pin
unit:mm
REV. A
4/4
Block Diagram
VBAT1 VBAT2 GNDP GNDP VOUT SW
Pin List
PIN PIN NAME PIN PIN NAME
VIO OCP
A2 D5 D1
OVP
VBAT1 VBAT2 VIO GND1 GND2 LEDGND GNDP GNDPS SGND RESETB SDA SCL
B1 E4 C3 A4 B4 B5 B3 C4 A1 A5 E5 E1
WPWMIN SW VOUT VLED SBIAS SSENS GC1 GC2 T1 T2 T3 T4
RESETB SCL SDA I/O
Level Shift
I2C interface Digital Control
DC/DC
C1 E2
Feed Back External PWM LEDGND VLED
WPWMIN
A3 E3 D4 C5 D3 C2
SBIAS SSENS SGND GC2 GC1 GND1 GND2
Sensor I/F
TSD ALC IREF VREF
T3
T1
T2
T4
D2
Cautions on use
(1) Absolute Maximum Ratings An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) Power supply and ground line Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention to the interference by common impedance of layout pattern when there are plural power supplies and ground lines. Especially, when there are ground pattern for small signal and ground pattern for large current included the external circuits, please separate each ground pattern. Furthermore, for all power supply pins to ICs, mount a capacitor between the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (3) Ground voltage Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no pins are at a potential lower than the ground voltage including an actual electric transient. (4) Short circuit between pins and erroneous mounting In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the pin and the power supply or the ground pin, the ICs can break down. (5) Operation in strong electromagnetic field Be noted that using ICs in the strong electromagnetic field can malfunction them. (6) Input pins In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input pin. Therefore, pay thorough attention not to handle the input pins, such as to apply to the input pins a voltage lower than the ground respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied, apply to the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (7) External capacitor In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc. (8) Thermal shutdown circuit (TSD) This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its operation. (9) Thermal design Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use. (10) About the pin for the test, the un-use pin Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a function manual and an application notebook. And, as for the pin that doesn't specially have an explanation, ask our company person in charge. (11) Rush Current Rush current may flow in instant in the internal logic unfixed state by the power supply injection order and delay. Therefore, be careful of power supply coupling capacity, a power supply and the width of grand pattern wiring, and leading about. (12) DC/DC converter Please select the low DCR inductors to decrease power loss for DC/DC converter.
REV. A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.
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